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|Title:||Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders|
|Citation:||Babaghorbani, P., Nai, S.M.L., Gupta, M. (2009-06-10). Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders. Journal of Alloys and Compounds 478 (1-2) : 458-461. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jallcom.2008.11.074|
|Abstract:||In this study, the influence of a wide range of reinforcements (SnO2, Cu, Y2O3, ZrO2 + 8 mol.% Y2O3 and TiB2) on the electrical resistivity of Sn-3.5Ag and Sn-3.5Ag-0.7Cu solders was investigated. The electrical resistivity test was conducted on the bulk samples of composite solders at ambient temperature. Results revealed that electrical resistivities of composites containing nanometer length scale reinforcement is not compromised for the optimal amount of reinforcement required to realize best tensile properties. This behavior was not displayed by composite containing micron size particles. The results of this study are expected to pave the way to develop lead-free nanocomposites especially for the industry using solid-state bonding technique. © 2008 Elsevier B.V. All rights reserved.|
|Source Title:||Journal of Alloys and Compounds|
|Appears in Collections:||Staff Publications|
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