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Title: Reactive Coupling of 4-Vinylaniline with Hydrogen-Terminated Si(100) Surfaces for Electroless Metal and "Synthetic Metal" Deposition
Authors: Xu, D.
Kang, E.T. 
Neoh, K.G. 
Tay, A.A.O. 
Issue Date: 13-Apr-2004
Source: Xu, D.,Kang, E.T.,Neoh, K.G.,Tay, A.A.O. (2004-04-13). Reactive Coupling of 4-Vinylaniline with Hydrogen-Terminated Si(100) Surfaces for Electroless Metal and "Synthetic Metal" Deposition. Langmuir 20 (8) : 3324-3332. ScholarBank@NUS Repository.
Abstract: Pristine and resist-patterned Si(100) substrates were etched by aqueous HF to produce hydrogenterminated silicon (H-Si(100)) surfaces. The H-Si(100) surface was then subjected to UV-induced reactive coupling of 4-vinylaniline (VAn) to produce the VAn monolayer-modified silicon (VAn-Si) surface. The VAn-Si surface was first functionalized with a "synthetic metal" by oxidative graft polymerization of aniline with the aniline moieties of the coupled VAn molecules. The composition and topography of the VAn-Si and polyaniline (PAn)-grafted VAn-Si (PAn-VAn-Si) surfaces were characterized by X-ray photoelectron spectroscopy and atomic force microscopy, respectively. The doping-undoping (protonation-deprotonation) and redox-coupling (metal reduction) behavior, as well as the electrical conductivity, of the surface-grafted PAn were found to be similar to those of the aniline homopolymer. The VAn-Si surface was also funtionalized by the electroless plating of copper. Not only did the VAn layer provide chemisorption sites for the palladium catalyst, in the absence of prior sensitization by SnCl2, during the electroless plating process, it also served as an adhesion promotion layer and a low-temperature diffusion barrier for the electrolessly deposited copper. Finally, micropatterning of the grafted PAn and of the electrolessly deposited copper were demonstrated on the resist-patterned VAn-Si surfaces.
Source Title: Langmuir
ISSN: 07437463
Appears in Collections:Staff Publications

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