Please use this identifier to cite or link to this item: https://doi.org/10.1115/1.4001145
Title: Numerical and experimental study of interface delamination in flip chip BGA package
Authors: Guojun, H.
Tay, A.A.O. 
Jing-En, L.
Yiyi, M.
Keywords: Chemical cure shrinkage
CTE
Flip chip BGA package
Interface delamination
MVCCM
Issue Date: Mar-2010
Citation: Guojun, H., Tay, A.A.O., Jing-En, L., Yiyi, M. (2010-03). Numerical and experimental study of interface delamination in flip chip BGA package. Journal of Electronic Packaging, Transactions of the ASME 132 (1) : 0110061-0110067. ScholarBank@NUS Repository. https://doi.org/10.1115/1.4001145
Abstract: The reliability of the flip chip package is strongly influenced by underfill, which has a much higher coefficient of thermal expansion (CTE) compared with other packaging materials and leads to large thermomechanical stresses developed during the assembly processes. Thermal expansion mismatch between different materials causes interface delamination between epoxy molding compound and silicon die as well as interface delamination between underfill and silicon die. The main objective of this study is to investigate the effects of underfill material properties, fillet height, and silicon die thickness on the interface delamination between epoxy molding compound and silicon die during a lead-free solder reflow process based on the modified virtual crack closure method. Based on finite element analysis and experiment study, it can be concluded that the energy release rates at reflow temperature are the suitable criteria for the estimation of interface delamination. Furthermore, it is found that underfill material properties (elastic modulus, CTE, and chemical cure shrinkage), fillet height, and silicon die thickness can be optimized to reduce the risk of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. Copyright © 2010 by ASME.
Source Title: Journal of Electronic Packaging, Transactions of the ASME
URI: http://scholarbank.nus.edu.sg/handle/10635/85495
ISSN: 10437398
DOI: 10.1115/1.4001145
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