Heating rate dependent delamination of metal-polymer interfaces: Experiments and modeling

Abstract

Bimaterial interfaces in microelectronics packages are the most common regions of failure under thermo-mechanical excursions. In this work, we report experimentally observed role of heating rate on the delamination initiation and propagation across a metal-polymer interface in a microelectronic package. We observe that the rate of delamination propagation increases with increasing heating rate. When the heating rate increases, in addition to the higher amount of delamination growth per unit time, experimental results suggests that higher growth will also incur per unit temperature (loading). Correspondingly, the temperature at which complete delamination occur decreases. Using finite element modeling with cohesive interfaces, we provide a plausible explanation to this observed phenomenon. The analyses indicate that the mechanical behavior of the bimaterial interface is sensitive to both temperature and thermal rate. © 2014 Springer Science+Business Media Dordrecht.