Please use this identifier to cite or link to this item:
https://doi.org/10.1243/09544054JEM432SC
DC Field | Value | |
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dc.title | Formation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition | |
dc.contributor.author | Thian, S. | |
dc.contributor.author | Tang, Y. | |
dc.contributor.author | Fuh, J.Y.H. | |
dc.contributor.author | Wong, Y.S. | |
dc.contributor.author | Loh, H.T. | |
dc.contributor.author | Lu, L. | |
dc.contributor.author | Tee, D.Z.S. | |
dc.date.accessioned | 2014-10-07T09:05:31Z | |
dc.date.available | 2014-10-07T09:05:31Z | |
dc.date.issued | 2006 | |
dc.identifier.citation | Thian, S., Tang, Y., Fuh, J.Y.H., Wong, Y.S., Loh, H.T., Lu, L., Tee, D.Z.S. (2006). Formation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 220 (2) : 329-333. ScholarBank@NUS Repository. https://doi.org/10.1243/09544054JEM432SC | |
dc.identifier.issn | 09544054 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/85226 | |
dc.description.abstract | Current lithography methods for creating micromoulds, other than LIGA, often use glass or silicon wafer as substrates. Since they are nonconductive, a metallic seed layer is required to be deposited over the substrate for electrodeposition to take place. This paper demonstrates a new method of creating a micromould directly onto a metal substrate, which can then be immediately utilized for microinjection moulding after nickel electrodeposition. The selected metal brass substrate is machined by a single-point diamond turning process to achieve a nanosurface of 12 nm. Standard UV lithography using SU8 photoresist was then employed to create a microgear onto the brass. At approximately 20 μm depth, nickel microcavity gear of 1 mm diameter was successfully created directly onto the brass substrate, after electrodeposited in nickel solution. A pulse current deposition method at a current density of 400 A/m2 was used for the deposition process. © IMechE 2006. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1243/09544054JEM432SC | |
dc.source | Scopus | |
dc.subject | Microcavity | |
dc.subject | Microinjection moulding | |
dc.subject | Micromould | |
dc.subject | Nickel electrodeposition | |
dc.subject | SU8 | |
dc.type | Article | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1243/09544054JEM432SC | |
dc.description.sourcetitle | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture | |
dc.description.volume | 220 | |
dc.description.issue | 2 | |
dc.description.page | 329-333 | |
dc.description.coden | PIBME | |
dc.identifier.isiut | 000238325600020 | |
Appears in Collections: | Staff Publications |
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