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|Title:||Formation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition|
|Authors:||Thian, S. |
|Citation:||Thian, S., Tang, Y., Fuh, J.Y.H., Wong, Y.S., Loh, H.T., Lu, L., Tee, D.Z.S. (2006). Formation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 220 (2) : 329-333. ScholarBank@NUS Repository. https://doi.org/10.1243/09544054JEM432SC|
|Abstract:||Current lithography methods for creating micromoulds, other than LIGA, often use glass or silicon wafer as substrates. Since they are nonconductive, a metallic seed layer is required to be deposited over the substrate for electrodeposition to take place. This paper demonstrates a new method of creating a micromould directly onto a metal substrate, which can then be immediately utilized for microinjection moulding after nickel electrodeposition. The selected metal brass substrate is machined by a single-point diamond turning process to achieve a nanosurface of 12 nm. Standard UV lithography using SU8 photoresist was then employed to create a microgear onto the brass. At approximately 20 μm depth, nickel microcavity gear of 1 mm diameter was successfully created directly onto the brass substrate, after electrodeposited in nickel solution. A pulse current deposition method at a current density of 400 A/m2 was used for the deposition process. © IMechE 2006.|
|Source Title:||Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture|
|Appears in Collections:||Staff Publications|
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