Please use this identifier to cite or link to this item: https://doi.org/10.1115/1.4006843
Title: Enhanced thermal transport in microchannel using oblique fins
Authors: Lee, Y.J.
Lee, P.S. 
Chou, S.K. 
Keywords: electronic cooling
enhanced microchannel
oblique fins
thermal management
Issue Date: 2012
Citation: Lee, Y.J., Lee, P.S., Chou, S.K. (2012). Enhanced thermal transport in microchannel using oblique fins. Journal of Heat Transfer 134 (10) : -. ScholarBank@NUS Repository. https://doi.org/10.1115/1.4006843
Abstract: Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nu ave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6°C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink. © 2012 American Society of Mechanical Engineers.
Source Title: Journal of Heat Transfer
URI: http://scholarbank.nus.edu.sg/handle/10635/85146
ISSN: 00221481
DOI: 10.1115/1.4006843
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