Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.actamat.2005.02.001
Title: Cubic silsesquioxane-polyimide nanocomposites with improved thermomechanical and dielectric properties
Authors: Huang, J.
Lim, P.C.
Shen, L.
Pallathadka, P.K.
Zeng, K. 
He, C.
Keywords: Dielectric
Nanostructure
Polymer matrix composites
Porous material
Silsesquioxane
Issue Date: May-2005
Citation: Huang, J., Lim, P.C., Shen, L., Pallathadka, P.K., Zeng, K., He, C. (2005-05). Cubic silsesquioxane-polyimide nanocomposites with improved thermomechanical and dielectric properties. Acta Materialia 53 (8) : 2395-2404. ScholarBank@NUS Repository. https://doi.org/10.1016/j.actamat.2005.02.001
Abstract: Two series of nanoporous polyimide nanocomposites with well-defined tether architecture have been prepared from octa(aminophenyl)silsesquioxane. Transmission electron microscopy, solid-state 29Si nuclear magnetic resonance, model reaction, and density measurement show that the nanostructures of the polyimide nanocomposites are well defined and can be adjusted accordingly. The polyimide nanocomposites exhibit tunable dielectric constant with a lowest value of 2.29. The thermomechanical properties of the polyimide have been improved significantly with the addition of octa(aminophenyl) silsesquioxane; for instance, glass transition temperature increases by ∼80 °C and storage modulus by 46%, as compared to the neat polyimide. Moreover, thermal stability, coefficient of thermal expansion, hardness, and moisture absorption of the polyimide nanocomposites are also improved significantly. © 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Source Title: Acta Materialia
URI: http://scholarbank.nus.edu.sg/handle/10635/84951
ISSN: 13596454
DOI: 10.1016/j.actamat.2005.02.001
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