Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.enbuild.2009.10.018
Title: An ETTV-based approach to improving the energy performance of commercial buildings
Authors: Chua, K.J. 
Chou, S.K. 
Keywords: Cooling energy requirement
Energy performance
Envelope Thermal Transfer Value
Issue Date: Apr-2010
Source: Chua, K.J., Chou, S.K. (2010-04). An ETTV-based approach to improving the energy performance of commercial buildings. Energy and Buildings 42 (4) : 491-499. ScholarBank@NUS Repository. https://doi.org/10.1016/j.enbuild.2009.10.018
Abstract: This paper aims to study the various parameters that affect the energy performance of commercial buildings in Singapore. The parameters are diverse, ranging from characteristics of construction of the walls and windows, to the various system settings and types within the building. Building energy performance is measured via two key indexes, namely, the Envelope Thermal Transfer Value (ETTV) and the annual cooling energy requirement (Ec). Parameters related to these two indexes are identified. An additional parameter, the solar absorptance of the wall, is further incorporated to calibrate the ETTV equation. A relative ranking on the functional parameters of ETTV has been performed to evaluate their effectiveness in lowering the ETTV of buildings. In addition, the impact of using cladding on ETTV is also studied. A correlation for Ec, expressed in the form of a simple linear equation, has been developed. This correlation accounts for the internal building loads, envelope loads, operating schedules and efficiency of the cooling equipment. Finally, ETTV and Ec have been employed to study the effects of chiller over-sizing and ventilation rates on building cooling energy. In the pursuit for better energy-efficient buildings, the approach presented in this paper contributes to the construct of sustainable energy-efficient built-environment. © 2009 Elsevier B.V. All rights reserved.
Source Title: Energy and Buildings
URI: http://scholarbank.nus.edu.sg/handle/10635/84861
ISSN: 03787788
DOI: 10.1016/j.enbuild.2009.10.018
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