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|Title:||Thermally robust phosphorous nitride interface passivation for InGaAs self-aligned gate-first n-MOSFET integrated with high-k dielectric|
|Authors:||Oh, H.J. |
|Source:||Oh, H.J.,Lin, J.Q.,Suleiman, S.A.B.,Lo, G.Q.,Kwong, D.L.,Chi, D.Z.,Lee, S.J. (2009). Thermally robust phosphorous nitride interface passivation for InGaAs self-aligned gate-first n-MOSFET integrated with high-k dielectric. Technical Digest - International Electron Devices Meeting, IEDM : 13.6.1-13.6.4. ScholarBank@NUS Repository. https://doi.org/10.1109/IEDM.2009.5424354|
|Abstract:||Plasma-based PH3 passivation technique is extensively studied for the surface passivation of InGaAs substrate prior to high-κ deposition. The comparative analysis reveals that the striking improvement is achieved when a stable covalent-bond PxNy layer forms at the interface during plasma PH3-passivation. We report that PxNy passivation layer improves thermal stability of high-k/InGaAs gate stack up to 750°C, which enables successful implementation of InGaAs MOSFETs by self-aligned gate-first process. By adopting PxNy passivation on InGaAs with MOCVD HfAlO and metal gate stack, we achieved subthreshold slope of 98mV/dec, G m=378mS/mm at Vd=1V, and effective mobility of 2557cm2/Vs at Eeff=0.24MV/cm. © 2009 IEEE.|
|Source Title:||Technical Digest - International Electron Devices Meeting, IEDM|
|Appears in Collections:||Staff Publications|
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