Please use this identifier to cite or link to this item: https://doi.org/10.1109/ESTIMedia.2013.6704498
Title: Thermal-aware mapping of streaming applications on 3D Multi-Processor Systems
Authors: Cox, M.
Singh, A.K.
Kumar, A. 
Corporaal, H.
Issue Date: 2013
Source: Cox, M.,Singh, A.K.,Kumar, A.,Corporaal, H. (2013). Thermal-aware mapping of streaming applications on 3D Multi-Processor Systems. ESTIMedia 2013 - 11th IEEE Symposium on Embedded Systems for Real-Time Multimedia : 11-20. ScholarBank@NUS Repository. https://doi.org/10.1109/ESTIMedia.2013.6704498
Abstract: Implementing Multi-Processor-Systems-on-Chip (MPSoCs) in 3-Dimensional (3D) ICs has many benefits, but the increased power density can cause significant thermal problems, resulting in decreased reliability, lifetime and performance. This paper presents a fast thermal-aware approach for mapping throughput constrained streaming applications on a 3D MPSoC. While there are some published works on thermal-aware mapping of real-time applications, throughput constraints and data dependencies are mostly not considered. Further, conventional approaches have long running times due to slow iterative thermal simulations. In our approach, to avoid slow thermal simulations for every candidate mapping, a thermal model of the 3D IC is used to derive an on-chip power distribution that minimizes the temperature before the actual mapping is done. Next, this distribution is used in a resource allocation algorithm to derive a mapping that meets the throughput constraint while approaching the target power distribution and minimizing energy consumption. This way, in contrast to most existing approaches, a mapping can be derived in the order of minutes. Experiments show a 7% reduction in peak temperature and a 47% reduction in communication energy compared to mappings based on load balancing. © 2013 IEEE.
Source Title: ESTIMedia 2013 - 11th IEEE Symposium on Embedded Systems for Real-Time Multimedia
URI: http://scholarbank.nus.edu.sg/handle/10635/84300
DOI: 10.1109/ESTIMedia.2013.6704498
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