Please use this identifier to cite or link to this item:
https://doi.org/10.1109/IEDM.2006.346915
DC Field | Value | |
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dc.title | Novel nickel-alloy suicides for source/drain contact resistance reduction in N-channel multiple-gate transistors with sub-35nm gate length | |
dc.contributor.author | Lee, R.T.P. | |
dc.contributor.author | Liow, T.-Y. | |
dc.contributor.author | Tan, K.-M. | |
dc.contributor.author | Lim, A.E.-J. | |
dc.contributor.author | Wong, H.-S. | |
dc.contributor.author | Lim, P.-C. | |
dc.contributor.author | Lai, D.M.Y. | |
dc.contributor.author | Lo, G.-Q. | |
dc.contributor.author | Tung, C.-H. | |
dc.contributor.author | Samudra, G. | |
dc.contributor.author | Chi, D.-Z. | |
dc.contributor.author | Yeo, Y.-C. | |
dc.date.accessioned | 2014-10-07T04:47:52Z | |
dc.date.available | 2014-10-07T04:47:52Z | |
dc.date.issued | 2006 | |
dc.identifier.citation | Lee, R.T.P.,Liow, T.-Y.,Tan, K.-M.,Lim, A.E.-J.,Wong, H.-S.,Lim, P.-C.,Lai, D.M.Y.,Lo, G.-Q.,Tung, C.-H.,Samudra, G.,Chi, D.-Z.,Yeo, Y.-C. (2006). Novel nickel-alloy suicides for source/drain contact resistance reduction in N-channel multiple-gate transistors with sub-35nm gate length. Technical Digest - International Electron Devices Meeting, IEDM : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IEDM.2006.346915" target="_blank">https://doi.org/10.1109/IEDM.2006.346915</a> | |
dc.identifier.isbn | 1424404398 | |
dc.identifier.issn | 01631918 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/84020 | |
dc.description.abstract | In this work, we examined the Schottky-Barrier height modulation of NiSi by the incorporation of Aluminum (Al), Titanium (Ti), Erbium (Er), and Yterbium (Yb) in NiSi to form different NiSi-alloys. Among the NiSi-alloy candidates investigated, it was found that the NiAl-alloy suicide provides the most effective Schottky-Barrier height lowering (∼250 meV) on n-Si(001) substrates. Integration of NiAl-alloy suicides as the source and drain (S/D) suicide material for Multiple-Gate transistors (MuGFETs) was explored, and shown to deliver a drive current IDsat enhancement of 34% compared to MuGFETs employing NiSi S/D. We further showed that the novel NiAl-alloy silicidation process is compatible with lattice-mismatched silicon-carbon (SiC) S/D stressors. NiAl-alloy suicide is therefore a promising S/D suicide material for reducing the high parasitic series resistance in narrow fin MuGFETs for enhanced device performance. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/IEDM.2006.346915 | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/IEDM.2006.346915 | |
dc.description.sourcetitle | Technical Digest - International Electron Devices Meeting, IEDM | |
dc.description.page | - | |
dc.description.coden | TDIMD | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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