Please use this identifier to cite or link to this item:
|Title:||Glass microprocessing by laser-induced plasma-assited ablation - Fundamental to industrial applications|
|Citation:||Sugioka, K., Midorikawa, K., Yamaoka, H., Gomi, Y., Otsuki, M., Hong, M.H., Wu, D.J., Wong, L.L., Chong, T.C. (2004). Glass microprocessing by laser-induced plasma-assited ablation - Fundamental to industrial applications. Proceedings of SPIE - The International Society for Optical Engineering 5506 : 1-10. ScholarBank@NUS Repository. https://doi.org/10.1117/12.580222|
|Abstract:||Laser-induced plasma-assisted ablation (LIPAA), in which a single conventional pulsed laser of small size is employed (typically 2nd harmonic of Nd:YAG laser), enables to process transparent materials like glass with micron order spatial resolution, high speed and low cost. In this process, a laser beam is first directed to a glass substrate placed in vacuum or air. The laser beam passes through the substrate since the wavelength of laser beam must have no absorption by the substrate for the LIPAA process. The transmitted laser beam is absorbed by a solid target (typically metal) located behind the substrate. The target is then ablated, resulting in plasma generation. Due to the interaction of the laser beam and the laser-induced plasma, significant ablation takes place at the rear surface of substrate. This process demonstrates surface microstructuring, crack-free marking, color marking, painting and selective metallization of glass. Based on these achievements, we have developed a prototype of workstation of LIPAA microfabrication system which is now commercially available. The discussion includes mechanism and practical applications in industry of LIPAA process.|
|Source Title:||Proceedings of SPIE - The International Society for Optical Engineering|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Sep 21, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.