Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.3046155
Title: Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path
Authors: Lee, C. 
Xie, J.
Issue Date: 2009
Source: Lee, C., Xie, J. (2009). Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1267-1271. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3046155
Abstract: A new concept of microelectromechanical system based thermoelectric power generator (TPG) with unique heat dissipation path is investigated in this study. By using solder based wafer bonding technology, the authors can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 μW/ cm2 for temperature difference of about 6 °C between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage. © 2009 American Vacuum Society.
Source Title: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
URI: http://scholarbank.nus.edu.sg/handle/10635/83609
ISSN: 10711023
DOI: 10.1116/1.3046155
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