Please use this identifier to cite or link to this item: https://doi.org/10.1109/VLSI-TSA.2012.6210119
Title: AlGaN/GaN-on-silicon MOS-HEMTs with breakdown voltage of 800 V and on-state resistance of 3 mΩ.cm 2 using a CMOS-compatible gold-free process
Authors: Liu, X.
Zhan, C.
Chan, K.W.
Liu, W.
Tan, L.S. 
Teo, K.L. 
Chen, K.J.
Yeo, Y.-C. 
Issue Date: 2012
Citation: Liu, X.,Zhan, C.,Chan, K.W.,Liu, W.,Tan, L.S.,Teo, K.L.,Chen, K.J.,Yeo, Y.-C. (2012). AlGaN/GaN-on-silicon MOS-HEMTs with breakdown voltage of 800 V and on-state resistance of 3 mΩ.cm 2 using a CMOS-compatible gold-free process. International Symposium on VLSI Technology, Systems, and Applications, Proceedings : -. ScholarBank@NUS Repository. https://doi.org/10.1109/VLSI-TSA.2012.6210119
Abstract: AlGaN/GaN MOS-HEMTs on a silicon platform were realized using a CMOS-compatible gold-free process. Process modules commonly used in CMOS were used, including gate stack formation, etching modules, etc. R on of 3 mΩ.cm 2 was obtained. Breakdown voltage V BR of 800 V was achieved, the highest for L GD below 10 μm for AlGaN/GaN/Si MOS-HEMTs fabricated using a gold-free process. The devices could be generally useful for cost-competitive power switching circuits with supply voltage in the range of several hundred volts. © 2012 IEEE.
Source Title: International Symposium on VLSI Technology, Systems, and Applications, Proceedings
URI: http://scholarbank.nus.edu.sg/handle/10635/83450
ISBN: 9781457720840
ISSN: 19308868
DOI: 10.1109/VLSI-TSA.2012.6210119
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