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|Title:||Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications|
|Citation:||Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C. (2009-02). Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications. Journal of Electronic Materials 38 (2) : 365-371. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0555-8|
|Abstract:||Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn 2 and Ag 9In 4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag 9In 4 in the bonded joints. © 2008 TMS.|
|Source Title:||Journal of Electronic Materials|
|Appears in Collections:||Staff Publications|
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