Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11664-008-0555-8
Title: Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
Authors: Made, R.I.
Gan, C.L.
Yan, L.L.
Yu, A.
Yoon, S.W.
Lau, J.H.
Lee, C. 
Keywords: IC
Indium
Low-temperature solder
MEMS
Packaging
Issue Date: Feb-2009
Source: Made, R.I., Gan, C.L., Yan, L.L., Yu, A., Yoon, S.W., Lau, J.H., Lee, C. (2009-02). Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications. Journal of Electronic Materials 38 (2) : 365-371. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0555-8
Abstract: Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn 2 and Ag 9In 4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180°C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag 9In 4 in the bonded joints. © 2008 TMS.
Source Title: Journal of Electronic Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/83103
ISSN: 03615235
DOI: 10.1007/s11664-008-0555-8
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

28
checked on Jan 16, 2018

WEB OF SCIENCETM
Citations

25
checked on Jan 16, 2018

Page view(s)

28
checked on Jan 23, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.