Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2013.02.023
Title: Impact of rapid thermal annealing temperature on non-metallised polycrystalline silicon thin-film diodes on glass
Authors: Hidayat, H.
Kumar, A. 
Law, F.
Ke, C.
Widenborg, P.I. 
Aberle, A.G. 
Keywords: Doping concentration
Electrochemical capacitance voltage
Junction depth
Poly-crystalline silicon
Rapid thermal annealing
Sheet resistance
Thin-film solar cells
Issue Date: 1-May-2013
Citation: Hidayat, H., Kumar, A., Law, F., Ke, C., Widenborg, P.I., Aberle, A.G. (2013-05-01). Impact of rapid thermal annealing temperature on non-metallised polycrystalline silicon thin-film diodes on glass. Thin Solid Films 534 : 629-635. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2013.02.023
Abstract: A rapid thermal annealing (RTA) process is performed to activate the dopants and anneal point defects in planar polycrystalline silicon (poly-Si) thin-film solar cell diodes on glass. The impact of the RTA peak temperature on the open-circuit voltage (Voc), the sheet resistance and the doping profiles of the non-metallised samples was investigated. An annealing temperature of about 1000 C was found to give the highest Voc and the lowest sheet resistance. The doping concentration was measured using the electrochemical capacitance voltage (ECV) method. The doping concentration was found to increase with increasing RTA temperature, before it decreased at high temperature. The junction depth was found to move away from the glass-side with increasing annealing temperature. The sheet resistances were calculated based on the ECV doping profiles and were found to have a trend similar to the experimental values obtained by the four-point probe method. The highest average Voc obtained in this work is 471 mV and it corresponds to the lowest sheet resistance. © 2013 Elsevier B.V.
Source Title: Thin Solid Films
URI: http://scholarbank.nus.edu.sg/handle/10635/82498
ISSN: 00406090
DOI: 10.1016/j.tsf.2013.02.023
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