Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.mee.2009.03.075
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dc.titleFlat band voltage control on low Vt metal-gate/high-κ CMOSFETs with small EOT (Invited Paper)
dc.contributor.authorChin, A.
dc.contributor.authorChang, M.F.
dc.contributor.authorLin, S.H.
dc.contributor.authorChen, W.B.
dc.contributor.authorLee, P.T.
dc.contributor.authorYeh, F.S.
dc.contributor.authorLiao, C.C.
dc.contributor.authorLi, M.-F.
dc.contributor.authorSu, N.C.
dc.contributor.authorWang, S.J.
dc.date.accessioned2014-10-07T04:28:31Z
dc.date.available2014-10-07T04:28:31Z
dc.date.issued2009-07
dc.identifier.citationChin, A., Chang, M.F., Lin, S.H., Chen, W.B., Lee, P.T., Yeh, F.S., Liao, C.C., Li, M.-F., Su, N.C., Wang, S.J. (2009-07). Flat band voltage control on low Vt metal-gate/high-κ CMOSFETs with small EOT (Invited Paper). Microelectronic Engineering 86 (7-9) : 1728-1732. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2009.03.075
dc.identifier.issn01679317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82366
dc.description.abstractThe unwanted high threshold voltage (Vt) is the major challenge for metal-gate/high-κ CMOS especially at small equivalent-oxide-thickness (EOT). We have investigated the high Vt issue that is due to flat-band voltage (Vfb) roll-off at smaller EOT. A mechanism of charged oxygen vacancies formed by interface reaction was proposed to explain the Vfb roll-off effect. This interface reaction can be decreased by inserting a thin interfacial SiON and using novel low temperature process. The self-aligned and gate-first metal-gate/high-κ CMOSFETs using these methods have achieved low Vt and good control of Vfb roll-off at small 0.6-1.2 nm EOT. Crown Copyright © 2009.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.mee.2009.03.075
dc.sourceScopus
dc.subjectCMOS
dc.subjectEOT
dc.subjectHigh-κ
dc.subjectMetal-gate
dc.subjectVfb roll-off
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1016/j.mee.2009.03.075
dc.description.sourcetitleMicroelectronic Engineering
dc.description.volume86
dc.description.issue7-9
dc.description.page1728-1732
dc.description.codenMIENE
dc.identifier.isiut000267460100053
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