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|Title:||Contact resistance reduction technology using aluminum implant and segregation for strained p-FinFETs with silicongermanium source/drain|
|Citation:||Sinha, M., Lee, R.T.P., Chor, E.F., Yeo, Y.-C. (2010-06). Contact resistance reduction technology using aluminum implant and segregation for strained p-FinFETs with silicongermanium source/drain. IEEE Transactions on Electron Devices 57 (6) : 1279-1286. ScholarBank@NUS Repository. https://doi.org/10.1109/TED.2010.2045682|
|Abstract:||We have demonstrated the introduction of an additional aluminum (Al) implant step in the fabrication of strained p-FinFETs with silicongermanium (SiGe) source/drain (S/D). Al is implanted into the p+-SiGe S/D region at energy of 10 keV and a dose of 2×1014 atoms/cm 2, followed by its segregation at the NiSiGe/p+-SiGe S/D interface during germanosilicidation. The presence of Al at this interface leads to lowering of the effective Schottky barrier height for hole conduction, which, in essence, lowers the S/D contact resistance RC. R C is a dominant component of the FinFET parasitic series resistance RSD, which is lowered by approximately 25% using this technology, correspondingly leading to a substantial increase in the saturation drive current. The novel Al-segregated NiSiGe/p+-SiGe S/D contact junction in p-FinFETs does not degrade short-channel effects or the NiSiGe film morphology. © 2010 IEEE.|
|Source Title:||IEEE Transactions on Electron Devices|
|Appears in Collections:||Staff Publications|
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