Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCSII.2013.2273727
Title: A crystal-less temperature-independent reconfigurable transmitter targeted for high-temperature wireless acoustic telemetry applications
Authors: Zhou, L.
Annamalai, M.
Koh, J.
Je, M.
Yao, L. 
Heng, C.-H. 
Keywords: Acoustic telemetry
high temperature
on-off keying (OOK)/chirp
reconfigurable transmitter
Issue Date: 2013
Citation: Zhou, L., Annamalai, M., Koh, J., Je, M., Yao, L., Heng, C.-H. (2013). A crystal-less temperature-independent reconfigurable transmitter targeted for high-temperature wireless acoustic telemetry applications. IEEE Transactions on Circuits and Systems II: Express Briefs 60 (9) : 542-546. ScholarBank@NUS Repository. https://doi.org/10.1109/TCSII.2013.2273727
Abstract: A reconfigurable acoustic telemetry transmitter that employs crystal-less temperature-independent frequency reference has been realized in a 1-$\mu\hbox{m}$ silicon-on-insulator complementary metal-oxide-semiconductor process. The transmitter can be configured to transmit either a three-channel chirp signal or a six-channel on-off keying (OOK) signal to provide flexibility based on channel characteristics. Different frequencies derived from the crystal-less temperature-independent frequency reference are directly modulated by input data before being combined and sent through a multiple-feedback low-pass filter. The resulting three-channel chirp signal achieves a total data rate of 60 b/s, whereas the six-channel OOK signal achieves a total data rate of 120 b/s. The frequency reference is realized through a frequency-locked loop that employs a resistor-capacitor phase shifter with a resistor temperature coefficient cancellation technique. It achieves a frequency inaccuracy of $\pm$1.94% over the temperature range of 175°C ∼ 275°C. Consuming 9 mW and occupying 25 mm2, this brief is the first reported integrated solution targeted for high-temperature acoustic telemetry in oil-drilling applications with the highest reported data rate. © 2013 IEEE.
Source Title: IEEE Transactions on Circuits and Systems II: Express Briefs
URI: http://scholarbank.nus.edu.sg/handle/10635/81857
ISSN: 15497747
DOI: 10.1109/TCSII.2013.2273727
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