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|Title:||Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation|
|Citation:||Wong, W.K.,Yin, Q.R.,Thong, J.T.L.,Phang, J.C.H.,Fang, J.W. (2000). Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 11-16. ScholarBank@NUS Repository.|
|Abstract:||This paper describes Scanning Electron Acoustic Microscopy (SEAM) applications, particularly to samples that are of interest to the microelectronics industry. Several applications of SEAM involving semiconductor and ferroelectric samples are discussed in this paper. The expanding scope of applications for SEAM presents exciting possibilities. The challenge ahead lies in understanding the contrast mechanisms in SEAM signal formation as well as correlating results to the physical properties of samples.|
|Source Title:||Conference Proceedings from the International Symposium for Testing and Failure Analysis|
|Appears in Collections:||Staff Publications|
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