Please use this identifier to cite or link to this item:
|Title:||Novel electrical performance analysis for leaded packages|
|Citation:||Jin, Z.,Ma, J.,Iyer, M.K.,Ooi, B.L.,Leong, M.S. (1998). Novel electrical performance analysis for leaded packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 101-104. ScholarBank@NUS Repository.|
|Abstract:||This paper presents a novel analysis of electrical performance in 208PQFP. S-parameters are used to model the package leads. Simultaneous switching noise (SSN) is analysed both in time and frequency domain. Higher frequency effects, such as resonance and reflection are also included in this simulation study.|
|Source Title:||IEEE Topical Meeting on Electrical Performance of Electronic Packaging|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Nov 16, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.