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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/81461
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dc.titleIC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
dc.contributor.authorNgan, King N.
dc.contributor.authorKang, Sing B.
dc.date.accessioned2014-10-07T03:08:34Z
dc.date.available2014-10-07T03:08:34Z
dc.date.issued1988
dc.identifier.citationNgan, King N.,Kang, Sing B. (1988). IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION. : 1850-1851. ScholarBank@NUS Repository.
dc.identifier.isbn0818608528
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/81461
dc.description.abstractAn algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.page1850-1851
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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