Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.280569
Title: Cleaning force in laser cleaning of silicon substrates
Authors: Song, W.D.
Lu, Y.F. 
Ye, K.D.
Tee, C.K.
Hong, M.H.
Liu, D.M.
Low, T.S.
Keywords: Cleaning force
Laser cleaning
Silicon substrate
Thermal stress
Issue Date: 1997
Citation: Song, W.D., Lu, Y.F., Ye, K.D., Tee, C.K., Hong, M.H., Liu, D.M., Low, T.S. (1997). Cleaning force in laser cleaning of silicon substrates. Proceedings of SPIE - The International Society for Optical Engineering 3184 : 158-165. ScholarBank@NUS Repository. https://doi.org/10.1117/12.280569
Abstract: A laser cleaning model was established for removal of non-absorbing particles from an absorbing solid surface by taking adhesion force and cleaning force into account. The cleaning force per unit area due to laser-induced thermal expansion of a substrate surface is γE AT(0, t), where γ, E, and δT(0, t) are the linear thermal expansion coefficient, the elastic modulus and temperature rise at the substrate surface, respectively. The cleaning condition and threshold fluence can be obtained by comparing the cleaning force and the adhesion force. The theoretical analysis shows that cleaning force increases with increasing laser fluence, deducing the pulse duration, or decreasing laser wavelength, which leads to a higher cleaning efficiency at higher laser fluence, smaller pulse duration or shorter laser wavelength. The experimental results show that the cleaning threshold fluence for laser removal of quartz particles from silicon surfaces is about 135 mJ/ cm2, which is in good consistency with the theoretical threshold fluence of 120 mJ/cm2. With increasing laser fluence, the cleaning efficiency increases, which has been predicted by our theoretical analysis.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/81389
ISSN: 0277786X
DOI: 10.1117/12.280569
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