Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/80501
Title: Geometric modelling of IC die bonds for inspection
Authors: Ngan, K.N. 
Kang, S.B.
Keywords: IC bond inspection
machine vision
pattern recognition
Issue Date: Jul-1989
Source: Ngan, K.N.,Kang, S.B. (1989-07). Geometric modelling of IC die bonds for inspection. Pattern Recognition Letters 10 (1) : 47-52. ScholarBank@NUS Repository.
Abstract: This paper describes an algorithm that has been developed to inspect the quality of wire bonds on an IC die. It employs a geometric model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. © 1989.
Source Title: Pattern Recognition Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/80501
ISSN: 01678655
Appears in Collections:Staff Publications

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