Please use this identifier to cite or link to this item: https://doi.org/10.1023/A:1006679625601
Title: Evaluation of silicon nitride and silicon carbide as efficient polysilicon grain-growth inhibitors
Authors: Cha, C.L.
Chor, E.F. 
Jia, Y.M.
Bourdillon, A.J. 
Gong, H. 
Pan, J.S.
Zhang, A.Q.
Tang, S.K.
Boothroyd, C.B.
Issue Date: 1-Sep-1999
Citation: Cha, C.L., Chor, E.F., Jia, Y.M., Bourdillon, A.J., Gong, H., Pan, J.S., Zhang, A.Q., Tang, S.K., Boothroyd, C.B. (1999-09-01). Evaluation of silicon nitride and silicon carbide as efficient polysilicon grain-growth inhibitors. Journal of Materials Science Letters 18 (17) : 1427-1431. ScholarBank@NUS Repository. https://doi.org/10.1023/A:1006679625601
Abstract: A technique to improve the smoothness of the floating polysilicon layer of non-volatile memory devices is proposed. Via low-energy N2 + and Ar+ ion implantation onto exposed deposited-polysilicon film, SixNy and SiC are formed at the top surface of the film. These silicon impurities act as additional nucleating centers in the film, promoting growth of small surface grains in the event of a following high-temperature process step. Better planarity of the film is achieved and this implies the generation of a good interface with the subsequently deposited or thermally grown interpoly dielectric. Overall, the results are promising for the control of surface roughness by Low-Energy Ion Implantation.
Source Title: Journal of Materials Science Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/80403
ISSN: 02618028
DOI: 10.1023/A:1006679625601
Appears in Collections:Staff Publications

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