Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/80310
Title: Building-in reliability for silver die attached light emitting diodes
Authors: Chim, W.K. 
Chong, K.Y.
Issue Date: Mar-1994
Source: Chim, W.K.,Chong, K.Y. (1994-03). Building-in reliability for silver die attached light emitting diodes. Microelectronics Reliability 34 (3) : 495-507. ScholarBank@NUS Repository.
Abstract: In this paper, we present a failure analysis and reliability case history of light emitting diodes (LEDs), used in a fibre optics transmitter product, bonded using silver die attach epoxy. The observed failure mode was a reduction in light output of the transmitter device due to increased forward voltage after pulsed, high current operation which was attributed to the electrical degradation of the silver die attach epoxy. Steps taken to design in reliability into the product involved experimental design to optimize the die attach process, evaluation of more robust epoxies which can withstand accelerated high temperature and high current burn-in conditions, and the use of an improved die back-contact metallization system. Reliability performance of the die attach system was predicted and extrapolated to actual field application and burn-in conditions. © 1994.
Source Title: Microelectronics Reliability
URI: http://scholarbank.nus.edu.sg/handle/10635/80310
ISSN: 00262714
Appears in Collections:Staff Publications

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