Please use this identifier to cite or link to this item: https://doi.org/10.1080/02652040410001729250
Title: Slow-cooling protocols for microcapsule cryopreservation
Authors: Heng, B.C. 
Yu, Y.-J.H. 
Ng, S.C.
Keywords: Cryopreservation
Dimethyl-sulphoxide
Ethylene-glycol
Microcapsule
Slow-cooling
Issue Date: Jun-2004
Source: Heng, B.C., Yu, Y.-J.H., Ng, S.C. (2004-06). Slow-cooling protocols for microcapsule cryopreservation. Journal of Microencapsulation 21 (4) : 455-467. ScholarBank@NUS Repository. https://doi.org/10.1080/02652040410001729250
Abstract: The relatively large size (300-400 μm) and fragile semi-permeable membrane of microcapsules makes them particularly prone to cryodamage. This study investigated slow-cooling protocols for the cryopreservation of microcapsules. Instead of a programmable freezing-machine, slow cooling was carried out directly within a -80° C refrigerator. A range of increasing cryo-protectant (DMSO and EG) concentrations with slow cooling was investigated. The results showed that 2.8 M (20% v/v) DMSO and 2.7 M (15% v/v) EG were optimal for microcapsule cryopreservation, resulting in ∼55-60%) of the microcapsules remaining intact, with a relatively high post-thaw cell viability of 80-85%. Post-thaw cell viability and microcapsule integrity were consistently higher at equivalent molarities of DMSO compared to EG. Hence, all subsequent studies utilized only DMSO. Post-thaw cell viability upon slow cooling with 2.8 M (20% v/v) DMSO was significantly improved in the presence of 0.25 M sucrose (>95%), but there was no enhancement in microcapsule integrity. Neither post-thaw cell viability nor microcapsule integrity was improved with multi-step exposure and removal of sucrose, compared to a single-step protocol. There was also no improvement in either post-thaw cell viability or microcapsule integrity in the presence of 20% (w/v) Ficoll. Hence, the optimal condition for microcapsule cryopreservation by slow-cooling is with 2.8 M (20% v/v) DMSO and 0.25 M sucrose. © 2004 Taylor & Francis Ltd.
Source Title: Journal of Microencapsulation
URI: http://scholarbank.nus.edu.sg/handle/10635/79978
ISSN: 02652048
DOI: 10.1080/02652040410001729250
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