Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/77433
Title: Effects of interfacial residual stress on Tg of epoxy resin
Authors: Wang, Hongbing 
Siow, Kok Siong 
Issue Date: 1997
Citation: Wang, Hongbing,Siow, Kok Siong (1997). Effects of interfacial residual stress on Tg of epoxy resin. Proceedings of the Electronic Technology Conference, EPTC : 228-232. ScholarBank@NUS Repository.
Abstract: Distinct differences in the glass transition temperatures (Tg) of epoxy resins were observed when their samples were prepared in two different ways. In the first method (A) of preparation, the mixture of epoxy resin and curing agent was cured and cooled directly in an aluminum pan for DSC measurement. There were strong interfacial residual stresses in these samples. In the second method (B), epoxy resin was cured and cooled on a poly-tetrafluoroethylene (PTFE) plate, cut into small circular pieces and then placed in aluminum pans, and no interfacial residual stresses in these samples. The curing and cooling conditions for samples prepared by the two methods were otherwise exactly the same. The samples by method A with strong residual stresses showed lower Tg and broader transition ranges (δT) than those by method B. With increase in the rate of cooling for epoxy resin, the Tg for samples by method A decreased more than that for samples by method B. The transition range for samples A also increased more. The effects of residual stress on Tg are substantiated by the experimental results of the relaxation of interfacial residual stress or the incorporation of freezing stress.
Source Title: Proceedings of the Electronic Technology Conference, EPTC
URI: http://scholarbank.nus.edu.sg/handle/10635/77433
Appears in Collections:Staff Publications

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