Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2004.05.114
Title: Thermal performance of a phase change material on a nickel-plated surface
Authors: Nurmawati, M.H.
Siow, K.S. 
Rasiah, I.J.
Keywords: Ni-plated Cu
Phase change material
Thermal interface material
Thermal resistance
Issue Date: Sep-2004
Citation: Nurmawati, M.H., Siow, K.S., Rasiah, I.J. (2004-09). Thermal performance of a phase change material on a nickel-plated surface. Thin Solid Films 462-463 (SPEC. ISS.) : 481-486. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.114
Abstract: Thermal control becomes increasingly vital with IC chips becoming faster and smaller. The need to keep chips within acceptable operating temperatures is a growing challenge. Thermal interface materials (TIM) form the interfaces that improve heat transfer from the heat-generating chip to the heat dissipating thermal solution. One of the most commonly used materials in today's electronics industry is phase change material (PCM). Typically, the heat spreader is a nickel-plated copper surface. The compatibility of the PCM to this surface is crucial to the performance of the TIM. In this paper, we report on the performance of this interface. To that end, an instrument to suitably measure critical parameters, like the apparent and contact thermal resistance of the TIM, is developed according to the ASTM D5470 and calibrated. A brief theory of TIM is described and the properties of the PCM were investigated using the instrument. Thermal resistance measurements were made to investigate the effects of physical parameters like pressure, temperature and supplied power on the thermal performance of the material on nickel-plated surface. Conclusions were drawn on the effectiveness of the interface and their application in IC packages. © 2004 Published by Elsevier B.V.
Source Title: Thin Solid Films
URI: http://scholarbank.nus.edu.sg/handle/10635/77275
ISSN: 00406090
DOI: 10.1016/j.tsf.2004.05.114
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