Please use this identifier to cite or link to this item: https://doi.org/10.4028/www.scientific.net/AMR.74.197
Title: Numerical simulation of stretchable and foldable silicon integrated circuits
Authors: Liu, Z.
Zhang, Y. 
Song, J.
Kim, D.-H.
Huang, Y.
Rogers, J.
Keywords: Buckling
Finite element analysis
Flexible electronics
Stretchable electronics
Issue Date: 2009
Source: Liu, Z., Zhang, Y., Song, J., Kim, D.-H., Huang, Y., Rogers, J. (2009). Numerical simulation of stretchable and foldable silicon integrated circuits. Advanced Materials Research 74 : 197-200. ScholarBank@NUS Repository. https://doi.org/10.4028/www.scientific.net/AMR.74.197
Abstract: This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies. © (2009) Trans Tech Publications.
Source Title: Advanced Materials Research
URI: http://scholarbank.nus.edu.sg/handle/10635/75244
ISBN: 0878493212
ISSN: 10226680
DOI: 10.4028/www.scientific.net/AMR.74.197
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