Please use this identifier to cite or link to this item:
|Title:||Numerical simulation of stretchable and foldable silicon integrated circuits|
Finite element analysis
|Citation:||Liu, Z., Zhang, Y., Song, J., Kim, D.-H., Huang, Y., Rogers, J. (2009). Numerical simulation of stretchable and foldable silicon integrated circuits. Advanced Materials Research 74 : 197-200. ScholarBank@NUS Repository. https://doi.org/10.4028/www.scientific.net/AMR.74.197|
|Abstract:||This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies. © (2009) Trans Tech Publications.|
|Source Title:||Advanced Materials Research|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Sep 14, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.