Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2007.373929
Title: Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package
Authors: Hu, G.
Tay, A.A.O.
Zhang, Y. 
Chew, S.
Issue Date: 2007
Source: Hu, G.,Tay, A.A.O.,Zhang, Y.,Chew, S. (2007). Experimental and numerical study of the effect of viscoelasticity on delamination in a plastic IC package. Proceedings - Electronic Components and Technology Conference : 1062-1068. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2007.373929
Abstract: Over the glass transition temperature, epoxy molding compound strongly exhibits viscoelastic behavior which causes its Young's modulus to be not only temperaturedependent but also time-dependent. In the present study, the viscoelastic properties of epoxy molding compound such as Prony coefficients, relaxation time and time-temperature shift factors are used for the delamination analysis. At the same time, end-notched flexure tests have been conducted at high temperatures under different loading rates for the investigation of the effect of viscoelasticity on the interface delamination between epoxy molding compound and copper. It is found that the energy release rate can still be a criterion for the viscoelastic bimaterial interface crack problem during lead-free solder reflow process. Furthermore, the critical energy release rate is rate-dependent and usually the critical energy release rate increases with the increase of loading rate for the interface delamination between epoxy molding compound and copper. © 2007 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/75225
ISBN: 1424409853
ISSN: 05695503
DOI: 10.1109/ECTC.2007.373929
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

5
checked on Jan 16, 2018

Page view(s)

14
checked on Jan 20, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.