Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.colsurfa.2004.05.030
Title: Ultra-thin composite films from polyimide and electroactive polymer through covalent molecular assembly
Authors: Zhang, F.
Srinivasan, M.P. 
Keywords: Covalent interlayer linkage
Improved stability
Layer-by-layer assembly
Reduced resistivity
Ultra-thin film
Issue Date: 5-May-2005
Source: Zhang, F., Srinivasan, M.P. (2005-05-05). Ultra-thin composite films from polyimide and electroactive polymer through covalent molecular assembly. Colloids and Surfaces A: Physicochemical and Engineering Aspects 257-258 : 509-514. ScholarBank@NUS Repository. https://doi.org/10.1016/j.colsurfa.2004.05.030
Abstract: Soluble polyimide with hydroxyl pendant groups (HPI) and poly(thiophene-3-acetic acid) (PTAA) were synthesized and used to fabricate a composite film through layer-by-layer (LBL) molecular assembly. The interlayer linkage is established through esters formed between the hydroxyls from HPI and carboxylate groups from PTAA. The LBL assembly was carried out on a quartz slide or silicon wafer surface-modified with 3-aminopropyltrimethoxysilane. Fourier-transform infrared (FT-IR) spectroscopy and X-ray photoelectron spectroscopy (XPS) analyses both confirmed the occurrence of interlayer covalent bonding. Linear increase in UV-vis absorption confirmed LBL growth of the film. After 6-bilayer construction, the composite film showed a reduced surface resistivity compared with that of the bare quartz slide and HPI cast film. Exposure to iodine vapor resulted in a further reduction in surface resistivity of the composite film. The film also showed good thermal stability. © 2004 Elsevier B.V. All rights reserved.
Source Title: Colloids and Surfaces A: Physicochemical and Engineering Aspects
URI: http://scholarbank.nus.edu.sg/handle/10635/74801
ISSN: 09277757
DOI: 10.1016/j.colsurfa.2004.05.030
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