Please use this identifier to cite or link to this item:
https://doi.org/10.1109/SMICND.2006.283965
DC Field | Value | |
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dc.title | SU8 adhesive bonding using contact imprinting | |
dc.contributor.author | Yu, L. | |
dc.contributor.author | Iliescu, C. | |
dc.contributor.author | Tay, F.E.H. | |
dc.contributor.author | Chen, B. | |
dc.date.accessioned | 2014-06-19T05:40:35Z | |
dc.date.available | 2014-06-19T05:40:35Z | |
dc.date.issued | 2007 | |
dc.identifier.citation | Yu, L.,Iliescu, C.,Tay, F.E.H.,Chen, B. (2007). SU8 adhesive bonding using contact imprinting. Proceedings of the International Semiconductor Conference, CAS 1 : 189-192. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/SMICND.2006.283965" target="_blank">https://doi.org/10.1109/SMICND.2006.283965</a> | |
dc.identifier.isbn | 1424401097 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/73891 | |
dc.description.abstract | The present work proposes an adhesive bonding technique, at wafer level, using SU-8 negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, or from a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 100°C and 200°C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield: 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device. © 2006 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/SMICND.2006.283965 | |
dc.source | Scopus | |
dc.subject | Adhesive bonding | |
dc.subject | Contact imprinting | |
dc.subject | SU-8 photoresist | |
dc.subject | Wafer-to-wafer bonding | |
dc.type | Conference Paper | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1109/SMICND.2006.283965 | |
dc.description.sourcetitle | Proceedings of the International Semiconductor Conference, CAS | |
dc.description.volume | 1 | |
dc.description.page | 189-192 | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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