Please use this identifier to cite or link to this item: https://doi.org/10.1109/SMICND.2006.283965
Title: SU8 adhesive bonding using contact imprinting
Authors: Yu, L. 
Iliescu, C.
Tay, F.E.H. 
Chen, B.
Keywords: Adhesive bonding
Contact imprinting
SU-8 photoresist
Wafer-to-wafer bonding
Issue Date: 2007
Source: Yu, L.,Iliescu, C.,Tay, F.E.H.,Chen, B. (2007). SU8 adhesive bonding using contact imprinting. Proceedings of the International Semiconductor Conference, CAS 1 : 189-192. ScholarBank@NUS Repository. https://doi.org/10.1109/SMICND.2006.283965
Abstract: The present work proposes an adhesive bonding technique, at wafer level, using SU-8 negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, or from a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 100°C and 200°C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield: 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device. © 2006 IEEE.
Source Title: Proceedings of the International Semiconductor Conference, CAS
URI: http://scholarbank.nus.edu.sg/handle/10635/73891
ISBN: 1424401097
DOI: 10.1109/SMICND.2006.283965
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