Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2005.09.072
Title: Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications
Authors: Kumar, K.M.
Kripesh, V.
Shen, L.
Tay, A.A.O. 
Keywords: Microstructure
Solder alloys
SWCNTs
Tensile strength
Issue Date: 10-May-2006
Source: Kumar, K.M., Kripesh, V., Shen, L., Tay, A.A.O. (2006-05-10). Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications. Thin Solid Films 504 (1-2) : 371-378. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.072
Abstract: In the present study, the influence of single-walled carbon nanotubes (SWCNTs) of 93% purity on the phase formation, microstructural characteristics and mechanical behaviour of conventional solder alloys (63Sn/37Pb and Sn/3.8Ag/0.7Cu) was studied. The composite solder specimens were prepared by mechanical mixing of SWCNTs with solder powders. The homogenous powder mixture was compacted, sintered and extruded at room temperature. The composite solder alloy was characterized by XRD and SEM to identify the phase formation and morphological features. The mechanical properties such as microhardness, tensile strength and percentage elongation of the nanocomposite solders were evaluated as a function of SWCNT addition. The addition of SWCNTs was observed to influence the grain size and interfacial reaction kinetics of solder alloys. This work describes the physical and microstructural properties of the 63Sn-37Pb and Sn-3.8Ag-0.7Cu solder material alloyed with different weight proportions of SWCNTs. In particular, the melting behaviour and mechanical properties of SWCNT-reinforced composite solders are discussed. © 2005 Elsevier B.V. All rights reserved.
Source Title: Thin Solid Films
URI: http://scholarbank.nus.edu.sg/handle/10635/73889
ISSN: 00406090
DOI: 10.1016/j.tsf.2005.09.072
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