Please use this identifier to cite or link to this item: https://doi.org/10.1109/PVSC.2012.6318252
Title: Stress analysis of silicon wafer based photovoltaic modules in operation
Authors: Yixian, L.
Tay, A.A.O. 
Keywords: Delamination
materials reliability
photovoltaic cells
silicon
thermal stresses
Issue Date: 2012
Source: Yixian, L.,Tay, A.A.O. (2012). Stress analysis of silicon wafer based photovoltaic modules in operation. Conference Record of the IEEE Photovoltaic Specialists Conference : 3172-3177. ScholarBank@NUS Repository. https://doi.org/10.1109/PVSC.2012.6318252
Abstract: One cause of failure in PV modules is delamination in the interfaces. After lamination, when layers of PV materials are bonded together at about 145°C and subsequently cooled down, residual stresses are induced due to the mismatch in coefficients of thermal expansion (CTE). When the PV laminate is subsequently framed and exposed to sunlight, the temperature distribution induced in the module will redistribute the residual stresses. The main objective of this paper is to employ finite element analysis to determine the stress distribution induced in the PV module during operation. Differences in stresses developed in modules with float glass covers and those with tempered glass covers were determined. © 2012 IEEE.
Source Title: Conference Record of the IEEE Photovoltaic Specialists Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73873
ISBN: 9781467300643
ISSN: 01608371
DOI: 10.1109/PVSC.2012.6318252
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