Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2007.4469820
Title: Optimization of reliability of copper column flip chip packages with variable compliance interconnects
Authors: Tay, A.A.O. 
Ho, S.L.
Issue Date: 2007
Source: Tay, A.A.O., Ho, S.L. (2007). Optimization of reliability of copper column flip chip packages with variable compliance interconnects. Proceedings of the Electronic Packaging Technology Conference, EPTC : 499-503. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469820
Abstract: This paper describes a parametric study of the reliability of solder joints in wafer level flip chip packages that employ copper column interconnects. In this study, the impact of the change in the compliance of the copper column interconnects on the fatigue life of the solder joints were investigated by varying the diameter of the copper column interconnects. 2-D elastic-plastic finite element analyses were carried out on packages with constant interconnect diameter as well as those with variable interconnect diameters within the same package. The effect of changing the pitch and the pad size were also studied. It was found that an effective strategy in increasing the fatigue life and hence the reliability of the solder joints is by distributing copper columns of lower compliance (greater diameter) near the center of the package and increasing the compliance of the copper columns (decreasing their diameter) towards the perimeter of the chip package. In addition, elastic-plastic-creep analysis was also performed on the packages. It was observed that the results from the elastic-plastic analysis and the elastic-plastic-creep analysis exhibit the same trend. © 2007 IEEE.
Source Title: Proceedings of the Electronic Packaging Technology Conference, EPTC
URI: http://scholarbank.nus.edu.sg/handle/10635/73728
ISBN: 1424413249
DOI: 10.1109/EPTC.2007.4469820
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

9
checked on Dec 17, 2017

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.