Please use this identifier to cite or link to this item: https://doi.org/10.1109/HDP.2005.251380
Title: Mechanics of interfacial delamination in IC packages undergoing solder reflow
Authors: Tay, A.A.O. 
Issue Date: 2006
Source: Tay, A.A.O. (2006). Mechanics of interfacial delamination in IC packages undergoing solder reflow. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/HDP.2005.251380
Abstract: When plastic packages undergo solder reflow after being subjected to moisture preconditioning, hygrothermal stresses are induced in the package. If these stresses are excessive popcorning failure will occur. It has been shown that popcorning failure is usually preceeded by delamination of either the pad/encapsulant interface or the die-attach-layer/pad interface. Fracture mechanics methodology has been shown to be a useful technique for analysing and predicting the onset of delamination. This paper describes an investigation on the mechanics of delamination at interfaces in typical plastic IC packages.
Source Title: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
URI: http://scholarbank.nus.edu.sg/handle/10635/73595
ISBN: 0780392930
DOI: 10.1109/HDP.2005.251380
Appears in Collections:Staff Publications

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