Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73587
Title: Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects
Authors: Aggarwal, A.O.
Raj, P.M.
Abothu, I.R.
Ravi, D.
Sacks, M.D.
Tay, A.A.O. 
Tummala, R.R.
Issue Date: 2004
Source: Aggarwal, A.O.,Raj, P.M.,Abothu, I.R.,Ravi, D.,Sacks, M.D.,Tay, A.A.O.,Tummala, R.R. (2004). Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects. Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces 9 : 69-73. ScholarBank@NUS Repository.
Abstract: This work explores novel material synthesis routes towards reworkable nano-dimensional interfaces for IC-package assembly, leading to bumpless and nano interconnections. Reworkability is addressed by a thin interface of lead-free high-strength solders. Two approaches, sol-gel process and electroless plating, were used to achieve these nano-dimensional bonding interfaces. In the sol-gel process, metal-organic polymer solutions were heat-treated in a reducing atmosphere at 400°C to form lead-free solders (Sn-Ag-Cu). In the electroless plating approach, lead-free alloy films were deposited from aqueous plating solutions consisting of suitable metal salts and reducing agents. This process was done at temperatures of 45°C. The lead-free solder composition was controlled by altering the plating bath formulation. Solder films formed from both the above approaches were demonstrated to bond copper pads. Solution-derived nano-solder technology is an attractive low-cost method for bumpless nano-interconnects and other applications such as MEMS hermetic packaging and compliant interconnect bonding.
Source Title: Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
URI: http://scholarbank.nus.edu.sg/handle/10635/73587
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