Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73579
Title: Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon
Authors: Arefin, S.
Li, X.P. 
Rahman, M. 
He, T.
Keywords: Cutting Edge Radius
Ductile Mode Cutting
Silicon Wafer
Subsurface Damage
Issue Date: 2005
Source: Arefin, S.,Li, X.P.,Rahman, M.,He, T. (2005). Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon. Transactions of the North American Manufacturing Research Institute of SME 33 : 113-119. ScholarBank@NUS Repository.
Abstract: An experimental study on the machined workpiece surface and subsurface damage in relation to the tool cutting edge radius in nanoscale ductile mode cutting of silicon wafers is presented. Cutting tests with tools in a range of edge radius are carried out to examine the machined surfaces for possible cracks and subsurface damage in relation to the cutting edge radius. The results show that as far as the chip formation is in ductile mode, the machined surface is free of cracks and subsurface damage. There is a critical upper bound of the tool edge radius, beyond which the chip formation mode transits from ductile to brittle due to the decrease of compressive stress in the chip formation zone.
Source Title: Transactions of the North American Manufacturing Research Institute of SME
URI: http://scholarbank.nus.edu.sg/handle/10635/73579
ISSN: 10473025
Appears in Collections:Staff Publications

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