Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.microrel.2004.03.005
Title: Impact life prediction modeling of TFBGA packages under board level drop test
Authors: Tee, T.Y.
Ng, H.S.
Lim, C.T. 
Pek, E.
Zhong, Z.
Issue Date: Jul-2004
Citation: Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., Zhong, Z. (2004-07). Impact life prediction modeling of TFBGA packages under board level drop test. Microelectronics Reliability 44 (7) : 1131-1142. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2004.03.005
Abstract: Detailed drop tests and simulations were performed on thin-profile fine-pitch BGA (TFBGA) and very-thin-profile fine-pitch BGA (VFBGA) packages at board level using testing procedures developed in-house. Various testing parameters were studied to understand the effects of drop height, drop orientation, number of PCB mounting screws to fixture, position of component on board, PCB bending and solder material. The uncertainty of impact life prediction was within ±4 drops, for a typical test of 50 drops. The relative performance of package was found to be different under board level drop test and thermal cycling test.
Source Title: Microelectronics Reliability
URI: http://scholarbank.nus.edu.sg/handle/10635/73523
ISSN: 00262714
DOI: 10.1016/j.microrel.2004.03.005
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