Please use this identifier to cite or link to this item:
|Title:||High-speed bend test method and failure prediction for drop impact reliability|
|Source:||Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T. (2006). High-speed bend test method and failure prediction for drop impact reliability. Proceedings - Electronic Components and Technology Conference 2006 : 1003-1008. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645776|
|Abstract:||The objective of this study is to obtain experimental failure models governing solder joint failure during drop impact testing of board assemblies. A high-speed bend test was developed to perform displacement-controlled bend test of board assemblies at the high flexing frequencies of drop impact. These test frequencies and amplitudes are not achievable by conventional universal testers. Experimental data was obtained for various PCB strain amplitudes, flexural frequencies solder alloys and pad finishes. Results from the high-speed bend tests are used to construct constant amplitude power law fatigue curves. Solder joint reliability found to be dependent on the test frequency, and therefore strain rate. The experimental failure data from these high-speed bend tests are a required basis for a drop impact failure criterion which can take into account frequency and amplitude effects and which is general enough to be applied to product level testing. © 2006 IEEE.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 6, 2017
WEB OF SCIENCETM
checked on Nov 19, 2017
checked on Dec 10, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.