Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2006.1645776
Title: High-speed bend test method and failure prediction for drop impact reliability
Authors: Seah, S.K.W.
Wong, E.H.
Mai, Y.W.
Rajoo, R.
Lim, C.T. 
Issue Date: 2006
Source: Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T. (2006). High-speed bend test method and failure prediction for drop impact reliability. Proceedings - Electronic Components and Technology Conference 2006 : 1003-1008. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645776
Abstract: The objective of this study is to obtain experimental failure models governing solder joint failure during drop impact testing of board assemblies. A high-speed bend test was developed to perform displacement-controlled bend test of board assemblies at the high flexing frequencies of drop impact. These test frequencies and amplitudes are not achievable by conventional universal testers. Experimental data was obtained for various PCB strain amplitudes, flexural frequencies solder alloys and pad finishes. Results from the high-speed bend tests are used to construct constant amplitude power law fatigue curves. Solder joint reliability found to be dependent on the test frequency, and therefore strain rate. The experimental failure data from these high-speed bend tests are a required basis for a drop impact failure criterion which can take into account frequency and amplitude effects and which is general enough to be applied to product level testing. © 2006 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73506
ISBN: 1424401526
ISSN: 05695503
DOI: 10.1109/ECTC.2006.1645776
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