Please use this identifier to cite or link to this item: https://doi.org/10.4028/www.scientific.net/KEM.467-469.662
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dc.titleGetting rid of the wires: Curved layer fused deposition modeling in conductive polymer additive manufacturing
dc.contributor.authorDiegel, O.
dc.contributor.authorSingamneni, S.
dc.contributor.authorHuang, B.
dc.contributor.authorGibson, I.
dc.date.accessioned2014-06-19T05:35:44Z
dc.date.available2014-06-19T05:35:44Z
dc.date.issued2011
dc.identifier.citationDiegel, O., Singamneni, S., Huang, B., Gibson, I. (2011). Getting rid of the wires: Curved layer fused deposition modeling in conductive polymer additive manufacturing. Key Engineering Materials 467-469 : 662-667. ScholarBank@NUS Repository. https://doi.org/10.4028/www.scientific.net/KEM.467-469.662
dc.identifier.isbn9783037850176
dc.identifier.issn10139826
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73492
dc.description.abstractThis paper describes an additive manufacturing technology that has the potential to print plastic components with integral conductive polymer electronic circuits. This could have a major impact in the fields of robotics and mechatronics as it has the potential to allow large wiring looms, often an issue with complex robotic systems, to be printed as an integral part of the products plastic shell. This paper describes the development of a novel Fused Deposition Modeling (FDM) process in which the layers of material that make up the part are deposited as curved layers instead of the conventional flat layers. This opens up possibilities of building curved plastic parts that have conductive electronic tracks and components printed as an integral part of the plastic component, thereby eliminating printed circuit boards and wiring. It is not possible to do this with existing flatlayer additive manufacturing technologies as the continuity of a circuit could be interrupted between the layers. With curved-layer fused deposition modeling (CLFDM) this problem is removed as continuous filaments in 3 dimensions can be produced, allowing for continuous conductive circuits.
dc.sourceScopus
dc.subjectAdditive manufacturing
dc.subjectConductive 3D printing
dc.subjectCurved layer fused deposition modeling
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.4028/www.scientific.net/KEM.467-469.662
dc.description.sourcetitleKey Engineering Materials
dc.description.volume467-469
dc.description.page662-667
dc.description.codenKEMAE
dc.identifier.isiut000303364700126
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