Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73464
Title: Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach
Authors: Chng, A.C.
Tay, A.A.O. 
Lim, K.M. 
Wong, E.H.
Issue Date: 2004
Source: Chng, A.C.,Tay, A.A.O.,Lim, K.M.,Wong, E.H. (2004). Fatigue life estimation of a Stretched-Solder-Column ultra-fine-pitch wafer level package using the macro-micro modelling approach. Proceedings - Electronic Components and Technology Conference 2 : 1586-1591. ScholarBank@NUS Repository.
Abstract: This paper presents package warpage and interconnect fatigue life estimates of Stretched-Solder-Column interconnections in a 20mmx20mm package with 100μm pitch. The modelling was carried out in two stages using the macro-micro modelling approach. The effect of interconnection height, as well as chip thickness and substrate CTE (coefficient of thermal expansion) on fatigue life is discussed. The results suggest that the substrate CTE will continue to be the key factor in determining the thermo-mechanical reliability of a large package with small interconnections.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73464
ISSN: 05695503
Appears in Collections:Staff Publications

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