Please use this identifier to cite or link to this item:
https://doi.org/10.1115/IMECE2006-13241
| DC Field | Value | |
|---|---|---|
| dc.title | Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder | |
| dc.contributor.author | Nai, S.M.L. | |
| dc.contributor.author | Wei, J. | |
| dc.contributor.author | Gupta, M. | |
| dc.date.accessioned | 2014-06-19T05:34:37Z | |
| dc.date.available | 2014-06-19T05:34:37Z | |
| dc.date.issued | 2006 | |
| dc.identifier.citation | Nai, S.M.L.,Wei, J.,Gupta, M. (2006). Effect of presence of multi-walled carbon nanotubes on the creep properties of Sn-Ag-Cu solder. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1115/IMECE2006-13241" target="_blank">https://doi.org/10.1115/IMECE2006-13241</a> | |
| dc.identifier.isbn | 0791837904 | |
| dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/73397 | |
| dc.description.abstract | In this study, Sn-Ag-Cu based nanocomposites with multi-walled carbon nanotubes (MWCNTs) as reinforcements were successfully synthesized using the powder metallurgy technique. Varying weight percentages of MWCNTs were blended together with micron size lead-free solder particles. The blended powder mixtures were then compacted, sintered and finally extruded at room temperature. The extruded materials were then used to characterize the melting point and to prepare lap-shear samples for creep tests. Miniature creep samples were created using a specially designed fixture and static loading creep tests were carried out on the solder joint samples at room temperature at 24N and 36N loads. Creep results showed improved creep resistance with the addition of MWCNTs. An attempt is made in the present study to correlate the variation in weight percentages of reinforcement with the creep properties of the resultant nanocomposite materials. Copyright © 2006 by ASME. | |
| dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1115/IMECE2006-13241 | |
| dc.source | Scopus | |
| dc.type | Conference Paper | |
| dc.contributor.department | MECHANICAL ENGINEERING | |
| dc.description.doi | 10.1115/IMECE2006-13241 | |
| dc.description.sourcetitle | American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP | |
| dc.description.page | - | |
| dc.description.coden | EEAEE | |
| dc.identifier.isiut | NOT_IN_WOS | |
| Appears in Collections: | Staff Publications | |
Show simple item record
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.