Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73375
Title: Drop impact: Fundamentals & impact characterisation of solder joints
Authors: Wong, E.H.
Rajoo, R.
Mai, Y.W.
Seah, S.K.W. 
Tsai, K.T.
Yap, L.M.
Issue Date: 2005
Source: Wong, E.H.,Rajoo, R.,Mai, Y.W.,Seah, S.K.W.,Tsai, K.T.,Yap, L.M. (2005). Drop impact: Fundamentals & impact characterisation of solder joints. Proceedings - Electronic Components and Technology Conference 2 : 1202-1209. ScholarBank@NUS Repository.
Abstract: This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application. © 2005 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73375
ISSN: 05695503
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

19
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.