Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2010.5702653
Title: Determination of tensile properties of lead-free solder joints using nanoindentation
Authors: Chandra Rao, B.S.S.
Zeng, K.Y. 
Kripesh, V.
Issue Date: 2010
Source: Chandra Rao, B.S.S., Zeng, K.Y., Kripesh, V. (2010). Determination of tensile properties of lead-free solder joints using nanoindentation. 2010 12th Electronics Packaging Technology Conference, EPTC 2010 : 309-314. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2010.5702653
Abstract: In this work, determination of tensile properties using depth-sensing technique has been demonstrated. An empirical model has been used to extract tensile properties of bulk pure Sn and lead free solder joints using nanoindentation technique. New scheme is proposed based on the non-linear curve fitting analysis of indentation load-displacement data. Elastic modulus, yield strength, perfect plastic hardness and strain hardening parameter of pure tin are derived from the complete indentation load-displacement data. This method is further extended to the nano-indentation experiments on various lead-free solder joints of 500μm size. Elastic modulus, yield strength, perfect plastic hardness and strain hardening parameter of bulk Sn and lead-free solder joints are compared with reported data. ©2010 IEEE.
Source Title: 2010 12th Electronics Packaging Technology Conference, EPTC 2010
URI: http://scholarbank.nus.edu.sg/handle/10635/73329
ISBN: 9781424485604
DOI: 10.1109/EPTC.2010.5702653
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