Please use this identifier to cite or link to this item: https://doi.org/10.1007/s00542-006-0116-0
Title: Defect-free wet etching through pyrex glass using Cr/Au mask
Authors: Tay, F.E.H. 
Iliescu, C.
Jing, J.
Miao, J.
Issue Date: Sep-2006
Source: Tay, F.E.H., Iliescu, C., Jing, J., Miao, J. (2006-09). Defect-free wet etching through pyrex glass using Cr/Au mask. Microsystem Technologies 12 (10-11) : 935-939. ScholarBank@NUS Repository. https://doi.org/10.1007/s00542-006-0116-0
Abstract: This paper reports the highest etch depth of annealed Pyrex glass achieved by wet etching in highly concentrated HF solution, using a low stress chromium-gold with assistance of photoresist as masking layer. The strategies to achieve that are: increasing the etch rate of glass and simultaneously increasing the resistance of Cr/Au mask in the etchant. By annealing the Pyrex glass and using a highly concentrated HF acid, a high etch rate can be obtained. Furthermore, a method to achieve a good resistance of the Cr/Au masking layer in the etching solution is to control the residual stress and to increase the thickness of Au deposition up to 1 μm. In addition, the presence of a hard baked photoresist can improve the etching performance. As a result, a 500-μm thick Pyrex glass wafer was etched through.
Source Title: Microsystem Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/73307
ISSN: 09467076
DOI: 10.1007/s00542-006-0116-0
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