Please use this identifier to cite or link to this item:
Title: Defect-free wet etching through pyrex glass using Cr/Au mask
Authors: Tay, F.E.H. 
Iliescu, C.
Jing, J.
Miao, J.
Issue Date: Sep-2006
Citation: Tay, F.E.H., Iliescu, C., Jing, J., Miao, J. (2006-09). Defect-free wet etching through pyrex glass using Cr/Au mask. Microsystem Technologies 12 (10-11) : 935-939. ScholarBank@NUS Repository.
Abstract: This paper reports the highest etch depth of annealed Pyrex glass achieved by wet etching in highly concentrated HF solution, using a low stress chromium-gold with assistance of photoresist as masking layer. The strategies to achieve that are: increasing the etch rate of glass and simultaneously increasing the resistance of Cr/Au mask in the etchant. By annealing the Pyrex glass and using a highly concentrated HF acid, a high etch rate can be obtained. Furthermore, a method to achieve a good resistance of the Cr/Au masking layer in the etching solution is to control the residual stress and to increase the thickness of Au deposition up to 1 μm. In addition, the presence of a hard baked photoresist can improve the etching performance. As a result, a 500-μm thick Pyrex glass wafer was etched through.
Source Title: Microsystem Technologies
ISSN: 09467076
DOI: 10.1007/s00542-006-0116-0
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Mar 20, 2019


checked on Mar 20, 2019

Page view(s)

checked on Feb 9, 2019

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.