Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73232
Title: Board level drop test and simulation of TFBGA packages for telecommunication applications
Authors: Tee, T.Y.
Ng, H.S.
Lim, C.T. 
Pek, E.
Zhong, Z.
Issue Date: 2003
Source: Tee, T.Y.,Ng, H.S.,Lim, C.T.,Pek, E.,Zhong, Z. (2003). Board level drop test and simulation of TFBGA packages for telecommunication applications. Proceedings - Electronic Components and Technology Conference : 121-129. ScholarBank@NUS Repository.
Abstract: Comprehensive drop tests, failure analyses, and simulations were performed on TFBGA and VFBGA packages at board level. The solder joint failure was induced by the combined stress of mechanical shock and PCB bending. The critical solder ball was observed to occur at the outermost corner solder joint, and fails along the solder and PCB and pad interface under peeling mode. This failure mechanism and location of critical solder joint were supported by same observations in both drop test and simulation.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73232
ISSN: 05695503
Appears in Collections:Staff Publications

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